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Sebastien Codeville

Photo of GDIP advisory board member Sebastien Codeville, CEO, KaiOS

CEO, KaiOS

Sebastien Codeville is CEO of KaiOS Technologies, the company behind an ecosystem of affordable digital products and services empowering people around the world through technology. In 2016, Sebastien led the company in the development and delivery of their flagship product, KaiOS, a leading mobile operating system. Kai’s mission is to open up new possibilities for individuals, organizations, and society by bringing mobile connectivity to the billions of people without internet. Devices running on the platform require limited memory, while still offering a rich user experience through access to apps like Google Assistant, WhatsApp, YouTube, Facebook, and Google Maps.

Sebastien is a founding member of KaiOS Technologies, bringing more than 20 years of experience in telecommunications and technology to the company. Under Sebastien’s leadership, KaiOS is experiencing explosive growth, with more than 150 million devices shipped in over 150 countries. Through partnerships with AT&T, Bullitt, China Mobile, Doro, HMD, MTN, Orange, Sprint, Vodacom, T-Mobile, and Transsion, KaiOS-powered devices have been shipped around the world to the U.S., Canada, Latin America, Europe, Africa, and Asia. The company has also rapidly expanded globally from 50 to more than 300 people within three years’ time.

Prior to his role as CEO at KaiOS Technologies, Sebastien had an impressive track record in the telecom industry as vice president, Products and Programs for North America, at TCT Mobile Inc., where he grew the U.S. business from US$30 million in 2010 to US$1 billion in 2016, with 15 million phones sold. In his role, Sebastien spearheaded the product portfolio selection, pricing, and product definition, as well as supervision of a product team operating in China. Earlier in his career, he held management positions at TCL Communications, Philips Semiconductors, and Alcatel Mobile.

Sebastien holds a master’s degree in business administration from HEC University in Asia and a master’s degree in electronic engineering from ISEN France.